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Flex-Rigid
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软硬结合板
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75/75 line/space – ultra high density
Sequential build-up (blind, buried, mixed materials)
Special technologies such as Bookbinder, silver shielding, buried substrates, etc…
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75/75线/间距 - 超高密度
连续堆积（盲，埋，混合材料）
Bookbinder，银屏蔽，埋地基板等特殊技术......
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HDI
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高频板
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Sequential buildup 4+N+4
Blind, buried, staggered & stacked
Via fill, POVIP, Micro via fill
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顺序累积4 + N + 4
盲目，埋孔，交错和堆叠
通过填充，POVIP，微通孔填充
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Thermal Dissipation & CTE
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热耗散&CTE
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Heat sink applications (internal & external)
Heavy copper construction including selective coin insertion
Specialized laminate utilization
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散热片应用（内部和外部）
重铜结构包括选择性硬插入
专业的层压板利用
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RF & Microwave
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射频&微波
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Full PTFE™ multilayer buildups
Mixed material (PTFE, FR4, Polyimides) including Rigid & Rigidflex
Specialized technologies including cavity, isolation, precision geometries & finishes.
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全PTFE™多层增强材料
混合材料（PTFE，FR4，聚酰亚胺），包括Rigid和Rigidflex
专业技术包括腔体，隔离，精密几何形状和表面处理。
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